Package Outline Drawings

Supertex offers a variety of packages and continues to develop new packages as well as mounting methods consistent with the most state-of-the-art techniques. The wide variety of package outline drawings that Supertex offers are referenced below.

B2 | C/NC | DJ | FB | FG | G1 | GA
K1/T | K2 | K4 | K5| K6 | K7 | L/LL/N3
LG/TG | MG | N2 | N5 | N7| N8 | ND
NG | NW | P | PG | PJ| QP | SG | WG
 Green Initiative
 
To view/download individual Package Outline Drawings,
click on the graphics of the packages below.
 
Package
Suffix		 Package Outline Drawing Package Description
B2 B2 Package 84-Lead BCC+
7.00x7.00mm body, 0.80mm height (max), 0.50mm pitch
C/NC B2 Package 20-Lead Ceramic Side-Brazed DIP
.980x.300in. body, .200in. height (max), .100in. pitch
DJ B2 Package 28-Lead Quad Cerpac
.490x.490in. body, .190in. height (max.), .050in. pitch
B2 Package 44-Lead Quad Cerpac
.690x.690in body, .190in height (max.), .050in pitch
FB FB Package 64-Lead FCBGA
8.00x8.00mm body, 2.45mm height (max.), 0.80mm pitch
FG 32-Lead LQFP
7.00x7.00mm body, 1.60mm height (max.), 0.80mm pitch
48-Lead LQFP
7.00x7.00mm body, 1.60mm height (max.), 0.50mm pitch
100-Lead MQFP
20.00x14.00mm body, 3.15mm height (max.), 0.65mm pitch, 3.20mm footprint
G1 26-Lead LLGA
6.00x6.00mm body, 0.60mm height (max), 0.65mm pitch
44-Lead LLGA
7.00x7.00mm body, 0.60mm height (max), 0.50mm pitch
GA 25-Ball fpBGA
5.70x5.00mm body, 1.20mm height (max.), 0.75mm pitch
26-Ball fpBGA
6.00x5.35mm body, 1.20mm height (max.), 0.65mm pitch
48-Ball fpBGA
7.00x8.00mm body, 1.16mm height (max.), 0.75mm pitch
49-Ball fpBGA
6.00x6.00mm body, 1.14mm height (max.), 0.80mm pitch
K1/T 3-Lead TO-236AB (SOT-23)
K1 5-Lead SOT-23
K2 7-Lead TO-220
K4 3-Lead TO-252 (D-PAK)
K5 3-Lead SOT-223
K6 6-Lead DFN
3.00x3.00mm body, 1.00mm height (max.), 0.95mm pitch (punched type)
8-Lead DFN
4.00x4.00mm body, 1.00mm height (max), 1.00mm pitch (dual pad)
8-Lead DFN
5.00x5.00mm body, 1.00mm height (max), 1.27mm pitch (dual pad)
10-Lead DFN
3.00x3.00mm body, 1.00mm height (max.), 0.50mm pitch
12-Lead QFN
4.00x4.00mm body, 1.00mm height (max), 0.80mm pitch
14-Lead QFN
5.00x5.00mm body, 1.00mm height (max), 1.27mm pitch
16-Lead QFN
3.00x3.00mm body, 0.85mm height (max), 0.50mm pitch
16-Lead QFN
4.00x4.00mm body, 1.00mm height (max), 0.65mm pitch
32-Lead QFN
5.00x5.00mm body, 1.00mm height (max), 0.50mm pitch
40-Lead QFN
6.00x6.00mm body, 1.00mm height (max), 0.50mm pitch
44-Lead QFN
7.00x7.00mm body, 1.00mm height (max), 0.50mm pitch, 3 pads
48-Lead QFN
7.00x7.00mm body, 1.00mm height (max), 0.50mm pitch
K7 8-Lead DFN
3x3mm body, 0.80mm height (max), 0.65mm pitch
10-Lead DFN
3.00x3.00mm body, 0.80mm height (max), 0.50mm pitch
10-Lead DFN
4.00x4.00mm body, 0.80mm height (max), 0.65mm pitch
12-Lead QFN
3.00x3.00mm body, 0.80mm height (max), 0.50mm pitch
16-Lead QFN
3.00x3.00mm body, 0.80mm height (max), 0.50mm pitch
16-Lead QFN
4.00x4.00mm body, 0.80mm height (max), 0.65mm pitch
32-Lead QFN
6.00x6.00mm body, 0.80mm height (max), 0.50mm pitch
40-Lead QFN
5.00x5.00mm body, 0.80mm height (max), 0.40mm pitch
L/LL/N3 3-Lead TO-92
LG/TG 8-Lead SOIC (Narrow Body)
4.90x3.90mm body, 1.75mm height (max), 1.27mm pitch
MG 8-Lead MSOP
3.00x3.00mm body, 1.10mm height (max), 0.65mm pitch
10-Lead MSOP
3.00x3.00mm body, 1.10mm height (max), 0.50mm pitch
N2
 3-Lead TO-39
N5 3-Lead TO-220
N7 14-Lead Ceramic Side-Brazed
.760x.288in body, .200in height (max), .100in pitch
N8 3-Lead TO-243AA (SOT-89)
ND Die in Waffle Pack
Please call factory
NG 14-Lead SOIC (Narrow Body)
8.65x3.90mm body, 1.75mm height (max.), 1.27mm pitch
16-Lead SOIC (Narrow Body)
9.90x3.90mm body, 1.75mm height (max), 1.27mm pitch
NW Die in Wafer Form
 Please call factory
P 14-Lead PDIP
.750x.310in body, .210in height (max), .100in pitch
16-Lead PDIP
.790x.310in body, .210in height (max), .100in pitch
28-Lead PDIP
1.380x.600in body, .250in height (max), .100in pitch
40-Lead PDIP
1.980x.600in body (max.), .250in height (max), .100in pitch
PG 44-Lead PQFP
10.00x10.00mm body, 2.35mm height (max.), 0.80mm pitch
64-Lead PQFP
20.00x14.00mm body, 3.40mm height (max.), 0.80mm pitch, 3.90mm footprint
80-Lead PQFP
20.00x14.00mm body, 3.40mm height (max.), 0.80mm pitch
100-Lead PQFP
20.00x14.00mm body, 3.40mm height (max.), 0.65mm pitch
PJ 20-Lead PLCC
.390x.390in body, .180in height (max.), .050in pitch
28-Lead PLCC
.490x.490in. body, .180in. height (max.), .050in. pitch
44-Lead PLCC
.690x.690in body, .180in height (max.), .050in pitch
QP 44-Lead QSOP
17.83x7.50mm body, 2.64mm height (max), 0.80mm pitch
SG 8-Lead SOIC (Narrow Body w/ Heat Slug)
4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch
WG 16-Lead SOW (Wide Body)
10.30x7.50mm body, 2.65mm height (max), 1.27mm pitch
20-Lead SOW (Wide Body)
12.80x7.50mm body, 2.65mm height (max), 1.27mm pitch
24-Lead SOW (Wide Body)
15.40x7.50 body, 2.65mm height (max), 1.27mm pitch
28-Lead SOW (Wide Body)
17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch

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FOR ADDITIONAL INFORMATION,
PLEASE CONTACT:
Kenneth Vickers, Marcom Manager
Phone: (408) 222-4810
Fax: (408) 222-4895
Email: kennethv@supertex.com

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