Package
Suffix |
Package Outline
Drawing |
Package Description |
|
B2 |
 |
84-Lead
BCC+
7.00x7.00mm body, 0.80mm height (max), 0.50mm pitch |
|
C/NC |
 |
20-Lead
Ceramic Side-Brazed DIP
.980x.300in. body, .200in. height (max), .100in. pitch |
|
DJ |
 |
28-Lead
Quad Cerpac
.490x.490in. body, .190in. height (max.), .050in. pitch |
 |
44-Lead
Quad Cerpac
.690x.690in body, .190in height (max.), .050in pitch |
|
FB |
 |
64-Lead
FCBGA
8.00x8.00mm body, 2.45mm height (max.), 0.80mm pitch |
|
FG |
 |
32-Lead
LQFP
7.00x7.00mm body, 1.60mm height (max.), 0.80mm pitch |
 |
48-Lead
LQFP
7.00x7.00mm body, 1.60mm height (max.), 0.50mm pitch |
 |
100-Lead
MQFP
20.00x14.00mm body, 3.15mm height (max.), 0.65mm pitch, 3.20mm footprint
|
|
G1 |
 |
26-Lead
LLGA
6.00x6.00mm body, 0.60mm height (max), 0.65mm pitch |
 |
44-Lead
LLGA
7.00x7.00mm body, 0.60mm height (max), 0.50mm pitch |
|
GA |
 |
25-Ball
fpBGA
5.70x5.00mm body, 1.20mm height (max.), 0.75mm pitch |
 |
26-Ball
fpBGA
6.00x5.35mm body, 1.20mm height (max.), 0.65mm pitch |
 |
48-Ball
fpBGA
7.00x8.00mm body, 1.16mm height (max.), 0.75mm pitch |
 |
49-Ball
fpBGA
6.00x6.00mm body, 1.14mm height (max.), 0.80mm pitch |
|
K1/T |
 |
3-Lead
TO-236AB (SOT-23) |
|
K1 |
 |
5-Lead
SOT-23 |
|
K2 |
 |
7-Lead
TO-220 |
|
K4 |
 |
3-Lead
TO-252 (D-PAK) |
|
K5 |
 |
3-Lead
SOT-223 |
|
K6 |
 |
6-Lead
DFN 3.00x3.00mm
body, 1.00mm height (max.), 0.95mm pitch (punched type) |
 |
8-Lead
DFN
4.00x4.00mm body, 1.00mm height (max), 1.00mm pitch (dual pad) |
 |
8-Lead
DFN
5.00x5.00mm body, 1.00mm height (max), 1.27mm pitch (dual pad) |
 |
10-Lead
DFN
3.00x3.00mm body, 1.00mm height (max.), 0.50mm pitch |
 |
12-Lead
QFN
4.00x4.00mm body, 1.00mm height (max), 0.80mm pitch |
 |
14-Lead
QFN
5.00x5.00mm body, 1.00mm height (max), 1.27mm pitch |
 |
16-Lead
QFN
3.00x3.00mm body, 0.85mm height (max), 0.50mm pitch |
 |
16-Lead
QFN
4.00x4.00mm body, 1.00mm height (max), 0.65mm pitch |
 |
32-Lead
QFN
5.00x5.00mm body, 1.00mm height (max), 0.50mm pitch |
 |
40-Lead
QFN
6.00x6.00mm body, 1.00mm height (max), 0.50mm pitch |
 |
44-Lead
QFN
7.00x7.00mm body, 1.00mm height (max), 0.50mm pitch, 3 pads |
 |
48-Lead
QFN
7.00x7.00mm body, 1.00mm height (max), 0.50mm pitch |
|
K7 |
 |
8-Lead
DFN
3x3mm body, 0.80mm height (max), 0.65mm pitch |
 |
10-Lead
DFN
3.00x3.00mm body, 0.80mm height (max), 0.50mm pitch |
 |
10-Lead
DFN
4.00x4.00mm body, 0.80mm height (max), 0.65mm pitch |
 |
12-Lead
QFN
3.00x3.00mm body, 0.80mm height (max), 0.50mm pitch |
 |
16-Lead
QFN
3.00x3.00mm body, 0.80mm height (max), 0.50mm pitch |
 |
16-Lead
QFN
4.00x4.00mm body, 0.80mm height (max), 0.65mm pitch |
 |
32-Lead
QFN
6.00x6.00mm body, 0.80mm height (max), 0.50mm pitch |
 |
40-Lead
QFN
5.00x5.00mm body, 0.80mm height (max), 0.40mm pitch |
|
L/LL/N3 |
 |
3-Lead
TO-92 |
|
LG/TG |
 |
8-Lead
SOIC (Narrow Body)
4.90x3.90mm body, 1.75mm height (max), 1.27mm pitch |
|
MG |
 |
8-Lead
MSOP
3.00x3.00mm body, 1.10mm height (max), 0.65mm pitch |
 |
10-Lead
MSOP
3.00x3.00mm body, 1.10mm height (max), 0.50mm pitch |
| |
 |
3-Lead
TO-39 |
|
N5 |
 |
3-Lead
TO-220 |
|
N7 |
 |
14-Lead
Ceramic Side-Brazed
.760x.288in body, .200in height (max), .100in pitch |
|
N8 |
 |
3-Lead
TO-243AA (SOT-89) |
|
ND |
 |
Die in
Waffle Pack
Please call factory |
|
NG |
 |
14-Lead
SOIC (Narrow Body)
8.65x3.90mm body, 1.75mm height (max.), 1.27mm pitch |
 |
16-Lead
SOIC (Narrow Body)
9.90x3.90mm body, 1.75mm height (max), 1.27mm pitch |
|
NW |
 |
Die in
Wafer Form
Please call factory |
|
P |
 |
14-Lead
PDIP
.750x.310in body, .210in height (max), .100in pitch |
 |
16-Lead
PDIP
.790x.310in body, .210in height (max), .100in pitch |
 |
28-Lead
PDIP
1.380x.600in body, .250in height (max), .100in pitch |
 |
40-Lead
PDIP
1.980x.600in body (max.), .250in height (max), .100in pitch |
|
PG |
 |
44-Lead
PQFP
10.00x10.00mm body, 2.35mm height (max.), 0.80mm pitch |
 |
64-Lead
PQFP
20.00x14.00mm body, 3.40mm height (max.), 0.80mm pitch, 3.90mm
footprint |
 |
80-Lead
PQFP
20.00x14.00mm body, 3.40mm height (max.), 0.80mm pitch |
 |
100-Lead
PQFP
20.00x14.00mm body, 3.40mm height (max.), 0.65mm pitch |
|
PJ |
 |
20-Lead
PLCC
.390x.390in body, .180in height (max.), .050in pitch |
 |
28-Lead
PLCC
.490x.490in. body, .180in. height (max.), .050in. pitch |
 |
44-Lead
PLCC
.690x.690in body, .180in height (max.), .050in pitch |
|
QP |
 |
44-Lead
QSOP
17.83x7.50mm body, 2.64mm height (max), 0.80mm pitch |
|
SG |
 |
8-Lead
SOIC (Narrow Body w/ Heat Slug)
4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch |
|
WG |
 |
16-Lead
SOW (Wide Body)
10.30x7.50mm body, 2.65mm height (max), 1.27mm pitch |
 |
20-Lead
SOW (Wide Body)
12.80x7.50mm body, 2.65mm height (max), 1.27mm pitch |
 |
24-Lead
SOW (Wide Body)
15.40x7.50 body, 2.65mm height (max), 1.27mm pitch |
 |
28-Lead
SOW (Wide Body)
17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch |